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Alchimer S.A.
Alchimer: NEXX Systems licenses Alchimer's eG ViaCoat Technology for Metallization of High Aspect Ratio TSVs
October 24th, 2008
Alchimer S.A., the nanometric TSV metallization company, has licensed its eG ViaCoat(TM) product for creating thin, conformal copper seed layers for TSV metallization to NEXX Systems, Inc., a leader in electro-deposition systems for through-silicon vias (TSV) applications. Under the terms of the agreement, Alchimer will supply NEXX with process recipes for eG ViaCoat and the use of chemistries to optimize wet Cu TSV metallization. Alchimer's scientists and engineers will also provide continuous support to NEXX by characterizing and customizing the process for a wide variety of barrier layer materials. The agreement is the first of its kind, in that it provides the...
Source: Health Business Week (2008-10-24)
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