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Alchimer
Alchimer’s Enhanced eG ViaCoat Achieves up to 80 Percent Reduction In Cost of Ownership for TSV Copper Seed
July 3rd, 2009
Alchimer S.A., a leading developer of innovative chemical formulations and processes for semiconductor-related nanometric coating deposition, announced that new enhancements to its eG ViaCoat process provide customer cost savings of up to 80 percent compared to dry vacuum processes. A major element of the savings is the ability to use existing plating equipment for the process, thus avoiding substantial capital investment and depreciation costs. Alchimer's eG ViaCoat is a wet deposition process for the copper seed metallization of through-silicon vias (TSVs), which are used to create interconnections in advanced 3D-packaging applications. These structures are typically...
Source: Health Business Week (2009-07-03)
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